Project Description
Robert BOSCH GmbH is the worldwide largest automotive system supplier. The Automotive Electronics (AE) division of BOSCH has been involved in design and manufacturing of ASICs in bipolar, CMOS and BCD technologies for automotive applications since the late sixties, leading to specific skills in design of ICs incorporating system knowledge. The AE division contributes with knowledge about automotive specific requirements for ICs which originate from system requirements (such as electronic control units). BOSCH promotes the extension of the application of new technologies to harsh automotive applications and highly reliable industry applications.
Robert Bosch is one of the largest automotive system supplier worldwide. The Automotive Electronics (AE) division of Bosch has been involved in design and manufacturing of ASICs in bipolar, CMOS and BCD technologies for automotive applications since the late sixties, leading to specific skills in design of ICs that incorporate system knowledge. Therefore the division AE of Bosch contributes knowledge about automotive specific requirements for ICs which originate from system requirements (such as electronic control units).
Bosch promotes the extension of the application of new technologies to the harsh automotive applications.
The safety critical nature of these application leads to extremely tough reliability requirements.
In Reutlingen, a wafer manufacturing line for submicron CMOS and BCD silicon processes is located as well as an IC design centre. The mainly contributing department to this project is especially responsible for the introduction of new methods and tools into the IC design flow, as well as the selection & qualification of semiconductor technology and packaging technology.
Worldwide, the Bosch group has 306,000 employees with a turnover of 52.3 billion €.
